A linear-time eigenvalue solver for finite-element-based analysis of large-scale wave propagation problems in on-chip interconnect structures

摘要

In this paper the analysis and design of next-generation VLSI circuits using accurate electromagnetics-based models result in numerical problems of very large scale is presented. Typically, the solution of a problem with N parameters requires at least O(N) computation. With next generation VLSI circuits, however, even O(N) is prohibitively high since N is very large. The method that partially addresses this issue was developed for full-wave modeling of large-scale interconnect structures. In this method, a number of seeds (a seed has a unique cross section) are first recognized from an interconnect structure. In each seed, the original wave propagation problem is represented as a generalized eigenvalue problem. The complexity of solving 3D interconnects of O(N) is then overcome by seeking the solution of a few 2D seeds, which is then post-processed to obtain the solution of the original 3D problem through the development of an on-chip mode-matching technique. The computational bottleneck is the solution of a generalized eigenvalue problem. Efficient algorithms such as ARPACK [2] still require O(M2) storage and operations due to a dense matrix-vector multiplication. We present an algorithm that provides a solution to the generalized eigenvalue problem with O(M) complexity, thus paving the way for the full-wave simulation of next generation VLSI circuits.